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Product ID: 04
Board to Board CCD Vision inspection & Packing
1.Bare chip,Flip chip,Dram,LED.
2.Wafer level package(wlp) chip.
3.Smt components,connectors.
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Board to board connecter CCD inspection & Packing
Click here for details.
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| Tape product size |
8,12,16,24,32,44,56(mm) |
| Throughput |
>=6000 UPH (units per. hour) |
| Pick & Place Accuracy |
กำ50u m |
| Heater |
DC/AC; 40W x 2, 40W x 4 |
| Facilities |
110V AC/1phase/60Hz; Air: 4~6kgf/cm² |
| Weight |
Approx. 200kg |
| Machine Dimensions |
1500(W) x 600(D) x 1910(H)mm |
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Ordering information:
- Minimum Order: Negotiable
- TEL: 886-3-3251286 / 3253705
- FAX: 886-3-3252898
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